• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    The invention relates to an electronic component (1), in particular a driver for a luminaire, comprising a housing (2) with two opposite openings (20), a printed circuit board (3) for accommodating electronic components, which is arranged in the housing (2) and extends at least partially between the openings (20) of the housing (2), and a potting compound, which fills a defined portion (4) between the openings (20) of the housing (2), wherein the portion (4) to the openings ( 20) is limited spatially by a respective bulkhead (5), which together with the housing (2) delimiting the partial area (4) substantially circumferentially closed, and wherein at least one of the bulkheads (5) formed as a sub-circuit board (see above) is.
    公开号:AT15525U1
    申请号:TGM111/2016U
    申请日:2016-05-20
    公开日:2017-11-15
    发明作者:
    申请人:Tridonic Gmbh & Co Kg；
    IPC主号:
    专利说明:

    description
    ELECTRONIC COMPONENT AND METHOD FOR THE PRODUCTION THEREOF
    The present invention relates to an electronic component, in particular a driver for a luminaire, and a method for its production. The invention further relates to a lamp with this electronic component and corresponding bulbs.
    Comparable electronic components, in particular drivers, converters, ballasts and the like for lights, are known from the prior art. These electronic components - such as drivers - usually have a circuit board with corresponding electronic components. This circuit board is usually arranged in a housing. The housing is used in particular for receiving and protecting the circuit board and electronic components and the attachment of the driver. For electrical connection of the circuit board, the housing usually has an opening through which the corresponding cables / wires are guided.
    Often it is desired to complete the housing according to a defined protection class tight. For this purpose, the circuit board having interior of the housing is at least partially potted with a corresponding potting compound. In unilaterally open housings, this one opening is used to insert the printed circuit board with the electronic components, the introduction of the wiring as well as the introduction of the potting compound. Such drivers can be provided, for example, in protection class IP 67.
    It has been found in practice to be advantageous to provide the cable feed to the driver and the Kabelwegführung from the driver (for example, to a bulb) at opposite ends of the driver or the housing. This arrangement makes it easier to connect the cables and to handle the driver. On the other hand, a housing open on both sides has a simple technical design. With such two-sided open housings, however, there is the problem of shedding the inside of the housing without loss of material in a safe and simple way with a potting compound. In order to shed the housing and thus the electronic components provided for this purpose, the openings must be closed as well as possible in order to prevent the potting compound from flowing out during the potting process.
    As potting compound, for example, asphalt comes into consideration, which is relatively viscous. In other potting materials, such as silicone or polyurethane, a particularly good sealing of the openings is required due to their low viscosity in order to prevent outflow of the potting material until its hardening.
    In the prior art, there are electronic components, which for casting the open on both sides of the interior of the housing on the opposite sides of the respective openings facing bulkheads. These bulkhead walls are provided as separate parts. After inserting the printed circuit boards with electronic components in the housing, the bulkhead walls are assigned assigned according to the respective openings. The thus limited by the two bulkhead walls and the housing area is then filled with a potting compound. To keep the bulkheads safe, they can be used in appropriately trained profile recordings of the housing. After inserting the bulkheads for lateral sealing of the housing and possibly placing a housing cover after the bulkheads were used, the housing can be potted with the appropriate potting compound.
    The to be provided for the casting bulkheads must therefore be used separately, which requires additional installation or manufacturing effort. Furthermore, after the manufacture of the electronic component, these bulkheads are available throughout the life of the component without additional benefit. In general, the bulkheads are also flexible and must be designed to be comparatively thick for a suitably resistant design for retaining the potting compound.
    It is therefore an object of the present invention to provide an electronic component and a method for its production, which overcome the disadvantages of the prior art.
    This object is solved by the subject matter of the independent claims. The dependent claims further form the central idea of the invention in a particularly advantageous manner.
    According to a first aspect, the invention relates to an electronic component. This may be, for example, a driver, a converter, a ballast or the like for a lamp. The electronic component has a housing with two opposite openings. Furthermore, the electronic component has a printed circuit board for receiving electronic components, which is arranged in the housing and extends at least partially between the openings of the housing. Likewise, the electronic component on a potting compound, which fills a defined portion between the openings of the housing. The partial area is spatially limited to the openings by a respective bulkhead which, together with the housing, delimits the partial area substantially peripherally closed. By providing the bulkheads, it is thus possible that the portion can be potted with the potting compound. At least one of the bulkheads is designed as a sub-circuit board.
    By using a sub-printed circuit board as a bulkhead, it is possible, on the one hand to replace the previously unused bulkhead walls by actually usable components, while at the same time the sub-circuit board (s) is provided for retaining the introduced (liquid) potting compound (are) , whereby a secure encapsulation of the housing is maintained. Also, for example, may be provided on the sub-circuit board electronic components, which were previously provided on the main circuit board. In this respect, there is a space optimization, since the sub-circuit boards are used to accommodate the electronic components and thus the entire space of the housing can be reduced.
    In a preferred embodiment, the sub-circuit board is mechanically and / or electrically connected to the circuit board. Consequently, a space-optimized, angled, usable printed circuit board surface can be provided by the electrical connection. The mechanical connection of the sub-circuit board with the circuit board also makes it possible to reduce the assembly costs of the electronic component, since the sub-circuit boards serving as bulkheads now no longer need to be inserted into the housing, but are automatically placed accordingly when inserting the circuit board to additionally serve its further purpose of retaining potting compound. Incidentally, any bulkheads not designed as sub-printed circuit boards can also be mechanically connected to the printed circuit board. The connection of the bulkheads, at least the sub-board (s), to the circuit board is preferably provided by a solder joint. Thus, the connection of the circuit board to the bulkheads (e.g., sub-board (s)) can be provided in a conventional manner. In addition, gaps between the circuit boards can be filled and thus closed.
    According to a preferred embodiment, the bulkheads, at least the sub-circuit board (s), preferably perpendicular to the circuit board. Preferably, therefore, the bulkhead walls extend substantially parallel to the plane of extent of the associated opening, in order thus to achieve the best possible spatial delimitation of the partial area to the outside, in order to reliably retain the potting compound until it hardens. For this purpose, the corresponding bulkhead preferably has a contour which essentially corresponds to that of the associated opening in order to close the latter in the best possible and preferably circumferential manner.
    The bulkheads, at least the sub-circuit board (s) are preferably at least partially laterally received or guided in a groove of the housing. This facilitates on the one hand the placement of the bulkhead walls and also allows an improved sealing of the section to the outside.
    The printed circuit board and / or the sub-printed circuit board (s) preferably further comprise electronic components. These can be provided at arbitrary locations of the printed circuit board and / or sub-printed circuit board (s) and, taken by themselves or as a whole, in total, for example, a driver circuit or the like. form.
    In a particularly preferred embodiment, in particular those electronic components may be provided, for example, on the sub-circuit boards, which are to be provided for an external application of the electronic component. In this way, it is possible, for example, to provide a printed circuit board, which can be used for all conceivable applications (in particular as a light driver). If now a corresponding housing or a converter for the outdoor area to be provided, so the at least partially formed as a sub-circuit board bulkheads can be provided in a simple manner. In this way, at the same time a corresponding bulkhead for the casting of the housing provided and on the other hand, the components for outdoor or outdoor use can be mounted on the circuit board. In this way, a particularly effective use of resources can be made possible.
    According to a further embodiment, the sub-printed circuit board (s) may have an RFID element, preferably with microchip and antenna. At least one part of the RFID element, in particular the antenna, can then be provided on the side of the subcircuit board facing away from the potting compound and preferably facing outwards. It is also conceivable to provide other elements in addition to RFID elements or NFC elements accordingly. If the sub-board has an RFID element, then, for example, a copper track on the sub-board can be used to provide an antenna of a corresponding element which serves for wireless radio transmission. This may be particularly advantageous if the housing itself is made of metal and a correspondingly provided sub-print for providing an antenna would otherwise have a significantly reduced radio performance within the housing. Thus, in order to sufficiently provide the radio performance of the RFID element, the (printed) antenna may be preferably provided on the sub-circuit board so as to be exposed to the outside; thus facing away from the potting compound or the partial area and facing the opening is provided.
    According to a further embodiment, the sub-circuit board (s) may also have filter components of an overvoltage protection unit (Burst and Surge Protection Ünit). These can be, for example, sheath current filters (VDRs), connections, fuses, etc. In this way, the same arrangement (electronic component), for example, on the one hand be used for an indoor application, which does not necessarily have to have a potting compound and in which the requirements with respect. Surge protection (burst and surge protection) are lower. On the other hand, such a case equipped with filter components housing can also be designed for higher surge protection (burst and surge protection) - eg. In an outdor application - and is then completed filled with potting compound.
    At least on one preferably on opposite sides of the circuit board, the corresponding area of the circuit board extends beyond the bulkheads to the outside of the molded portion. The printed circuit board thus protrudes out of the potted area toward or out of the openings on one or opposite sides. These areas can be used in a defined way. For example, in this area certain electronic components, which must be accessible from the outside, be provided. Alternatively or additionally, connecting elements for the preferably detachable provision of conductors can be provided on these areas.
    In general, preferably, the circuit board and / or sub-circuit board (s) have at least one connection element for preferably releasable provision of conductors. The connection element is preferably provided outside of the molded portion; for example, on the protruding (exposed) area of the printed circuit board or the (exposed) outside of the sub-printed circuit board (s).
    In a preferred embodiment, the housing may be formed in two parts, so that a mounting side for arranging the circuit board and / or bulkheads (including sub-circuit board (s)) can be selectively exposed in the housing. Thus, for example, the circuit board which is mechanically connected to the sub-printed circuit boards can be inserted via the closable housing side in such a way that the sub-printed circuit boards or bulkheads are accommodated in corresponding lateral grooves in the housing and thus provided in a defined position for a potting process.
    The potting compound may preferably be a base matrix such as asphalt, silicone, in particular silicone resin, or polyurethane. The potting compound preferably has filler particles. These may be, for example, filler particles for influencing and in particular adjusting the viscosity of the base matrix. These include, for example, filler particles such as preferably TiO 2, SiO 2, Al 2 O 3, polymer particles, e.g. Latex, and / or glass particles in question. It is also possible to use filler particles which serve (in addition) to increase the heat conductivity of the potting compound. Thus, a potting compound tailored to the requirements can be provided.
    The molded housing preferably corresponds to a defined protection class, such as (at least) IP 65 and further preferably (at least) IP 67.
    The electronic component is preferably a driver, a converter, a ballast and the like for lights, especially an LED driver for a light.
    According to a further aspect of the invention, therefore, the invention further relates to a lamp comprising an electronic component according to the present invention and a light source, in particular an LED, which (s) is electrically connected to the operation of the lamp with the electronic component.
    According to a further aspect, the present invention further relates to a method for producing an electronic component, in particular an electronic component according to the present invention. The method comprises the following steps for this purpose: providing a housing with two opposing openings, arranging a printed circuit board for accommodating electronic components in the housing, so that the printed circuit board extends at least partially between the openings of the housing, - Arranging bulkheads in the housing such that they together with the
    Housing (ie the housing wall) define a defined portion - ie inside the housing - closed substantially circumferentially, by spatially delimiting the portion each to the openings, at least one of the bulkheads is designed as a sub-circuit board, and [0030] - Potting the portion with a potting compound, which fills at least the Teilbe rich between the openings of the housing.
    By means of this method, an electronic component can be produced, which has two opposing openings, for example, for supplying corresponding electrical conductors, and which at the same time in a simple and safe manner - was cast - for example, to provide a defined protection class. The elements for retaining the potting compound at the corresponding openings thereby at least partially form a usable part of the electronic component, in that they are provided as printed circuit board elements, for example for accommodating electronic components.
    The bulkheads, at least the sub-circuit board (s) is preferably mechanically connected to the circuit board, preferably soldered, particularly preferably before the circuit board with the associated bulkheads or sub-circuit board (s) is disposed in the housing.
    In this way, the bulkhead walls to be provided are preferably provided automatically at the onset of the printed circuit board in the housing at a defined location, which consequently reduces the overall assembly effort or production costs.
    The bulkheads, at least the sub-circuit board (s), can be at least partially inserted laterally into a groove of the housing. This leads to a secure reception of the bulkhead walls, on the one hand to achieve a defined positioning of the same and on the other hand to provide an improved sealing function for the Vergießvorgang. The groove can also be used to safely guide the circuit boards when inserted into the housing.
    The housing is preferably formed in two parts, so that a mounting side for arranging the printed circuit board and / or bulkheads (at least the sub-printed circuit board (s)) - ie the insertion of the same in the housing - is optionally exposed in the housing. This allows easy insertion of the circuit boards in the housing. The housing can be closed either before or after the Vergießvorgang by means of the lid.
    The step of potting the subregion can preferably be followed by a curing step for (active) curing of the potting compound - for example using UV irradiation. Preferably, the step of potting and the subsequent step of curing are repeated several times. For example, several curing steps can preferably be applied alternately to several potting steps.
    Further embodiments of the present invention will be described below with reference to the figures of the accompanying drawings. 1 shows a partial sectional view in plan view of an electronic component according to an embodiment of the invention, FIG. 2 shows a perspective view of a part of a printed circuit board with a printed circuit board of the electronic component according to the invention according to FIG 1 shows a simplified representation, [0039] FIG. 3a shows a front view of the printed circuit boards according to FIG. 2 in viewing direction IIIa, [0040] FIG. 3b shows a plan view of the printed circuit boards according to FIG. 2 in the viewing direction IIIb, and [0041] FIG 3c shows a side view of the printed circuit boards according to FIG. 2 in the direction of view Ille.
    Fig. 1 shows an inventive electronic component 1 according to the present invention. Such an electronic component 1 may in particular be a driver for a luminaire (not shown). In particular, this may be an LED driver. Other electronic components 1 are conceivable, such as converters, ballasts and the like.
    The electronic component 1 has a housing 2. The housing 2 may be made of a material customary for such components 1. For example, here comes a housing 2 made of metal, plastic or other suitable material into consideration. The invention is not limited to a particular material.
    The housing 2 has two opposite openings 20, wherein in Fig. 1, only an opening 20 is shown. The corresponding other opening is located in the embodiment of FIG. 1 at the opening 20 shown opposite side of the electronic component 1, ie in the plane on the right side of FIG. 1. The two the opening 20 having sides of the housing. 2 or the electronic component 1 can be constructed mirror-symmetrically. Overall, the entire housing 2 can be constructed mirror-symmetrically. Of course, these pages or the housing 2 can also be designed according to the requirements of the electronic component 1 according to individual.
    1, the electronic component 1 further comprises a printed circuit board 3 for receiving electronic components (not shown). The printed circuit board 3 is arranged in the housing 2 and extends at least partially between the openings 20 of the
    Housing 2.
    The electronic component 1 has a defined portion 4 in the interior and between the two openings 20 of the housing 2. This portion 4 is spatially limited to the openings 20 through a respective bulkhead 5. The bulkheads 5, of which only one (the left one) is shown in FIG. 1, delimit together with the housing 2, the partial area substantially circumferentially closed. For this purpose, the respective bulkhead 5 preferably has an outer contour corresponding to the associated opening 20, in order to rest on the housing wall as closed as possible on the circumference. In this way, a preferably fully demarcated space (partial area 4) is provided, into which at least one part-in particular a component comprising electronic components-of the printed circuit board 3 is arranged.
    The partial region 4 of the electronic component 1 is at least partially and preferably completely filled with a potting compound, which is not shown in FIG. 1 for the sake of clarity. This potting compound may be a base matrix such as asphalt and preferably silicone or polyurethane. Further, the potting compound may have filler particles which may affect the viscosity of the base matrix (e.g., silicone resin) (or by which the viscosity of the potting compound can be arbitrarily set within certain limits). For example, TiO 2, SiO 2, Al 2 O 3, polymer particles (for example latex) and / or glass particles can be used as filler particles. Likewise, filler particles can be used which (in addition) improve the heat conductivity of the potting compound. By the circumferentially limited portion 4 this can be cast in a simple manner with a potting compound low viscosity.
    According to the invention, at least one of the bulkheads 5 is formed as a sub-printed circuit board 50. In this way, it is possible to give the provided for retaining the potting bulkheads an additional benefit, which goes beyond the manufacturing process of the electronic component 1.
    The sub-circuit board 50 and the bulkheads 5 may preferably be mechanically connected to the circuit board 3. According to a preferred embodiment, as shown in Figures 2 and 3, while the sub-circuit board 50 (or bulkhead 5) have a projecting portion 51, which is inserted into a corresponding recess 30 of the circuit board 3 and engages and thus mechanically connected to this. For secure connection of the printed circuit board 3 with the sub-printed circuit board 50 (or bulkhead 5) they can be soldered to each other via solder areas 6. Of course, other mechanical types of connection of the circuit board with the sub-circuit boards 50 and bulkheads 5 are conceivable. Also, the circuit boards 3, 50 (or bulkhead 5) glued together or connected to each other in other positive, non-positive and / or cohesive manner.
    Alternatively or additionally, the circuit board 3 may be electrically connected to the sub-circuit board 50. In this way, the usable conductor surface can be provided in the most compact manner, so that a space optimization can be achieved. Because the circuit board 3 can be shortened by the surface of the sub-circuit board (s) 50 in length, which then angled over the sub-circuit board (s) 50 is available and thus leads to a total compact design of the electronic component 1.
    As can be seen in particular Figures 1 to 3, the bulkheads 5 and sub-circuit boards 50 are perpendicular to the circuit board 3 and / or extend substantially parallel to the plane of extension of the associated opening 20. Consequently, the portion 4 is spatially limited to the outside in a spatially effective manner.
    As can be seen in particular Figure 1, the bulkhead 5 and sub-circuit board 50 may be at least partially received laterally in a groove 21 of the housing 2. This groove 21 not only allows a defined positioning of the bulkheads 5 and sub-circuit boards 50, but preferably also provides for an improved sealing function for a corresponding Vergießvorgang due to the preferred dense system or recording of the bulkhead 5 and sub-circuit board 50 in the In addition, in this way, the pressure exerted by the potting or the potting compound pressure force on the bulkhead 5 in a secure manner by the groove 21 and the system of the bulkhead 5 are received in the groove 21. A groove 21 may for example be provided on two opposite housing wall sections or sides.
    As can be seen in particular Figure 1 and Figure 2, extends at least on one, preferably on both opposite sides of the circuit board 3, a portion 31 of the circuit board 3 via the bulkheads 5 and sub-circuit board 50 to the outside or to the outside of the molded portion 4. This area 31 of the printed circuit board 3 is thus accessible from the outside with respect to the electronic component 1 ready. Accordingly, components, that is, for example, electrical or electronic components which must be provided accessible from the outside, can be provided on this region 31, while at the same time components of the electronic component 1 to be protected by the potting compound can be provided in the potted portion 4.
    As can be seen from FIG. 1, the printed circuit board 3 and / or the sub-printed circuit board 50 can have at least one connecting element 7 for the preferably detachable provision of cables or conductors. The connection element 7 is preferably provided outside of the molded portion 4 and thus accessible from the outside in the molded state of the electronic component 1. This is particularly useful for corresponding electronic components 1 for lights in which, for example, the driver or converter for connection to a luminaire according to accessible connection elements 7 has.
    In order to simplify casting of the electronic component 1 or the placement or insertion of the printed circuit board 3 or bulkheads 5 or sub-printed circuit board (s) 50, the housing 2 may be in several parts - in particular in two parts - so that a mounting side for placing or inserting the printed circuit board 3 and / or bulkheads 5 (or sub-printed circuit board (s) 50) in the / the housing can be optionally exposed.
    In the potted state, the housing 2 or the electronic component 1 can correspond to a defined protection class. This may be, for example, the protection class IP65 or a higher protection class, preferably (at least) IP67 act.
    The circuit board 3 and / or the sub-circuit board (s) 50 may include electronic components. Depending on how the electronic component 1 is formed, the components may be provided at different areas of the aforementioned printed circuit boards 3, 50. For example, it is conceivable to provide the printed circuit board 3 with basic components and, depending on the field of application of the electronic component 1, to provide it with specific electronic components by placing corresponding sub-printed circuit boards 50. In this way, for example, an electronic component 1 can be provided for outdoor use, which is cast after insertion of the printed circuit boards 3, 50 in the housing 2 at least in the partial area 4.
    The sub-circuit board (s) 50 may further include, for example, an RFID element. This may preferably have a microchip and an antenna. In particular, the RFID element can be designed for a frequency range of 2.4 GHz. At least part of the RFID element, in particular the antenna, may be provided on the side of the sub-circuit board 50 facing away from the potting compound or the sub-area 4 and preferably facing outwards. The antenna is thus provided directed outwards, which results in a good radio performance compared to an arrangement of a corresponding antenna within the housing 2 or partial area 4.
    According to a further aspect, the invention further relates to a lamp, not shown, with an inventive electronic component 1 and lighting means, in particular LEDs, which are electrically connected to the operation of the lamp with the electronic component 1.
    In the following, a method for producing an electronic component 1 will be described.
    In a first step, a housing 2 with two opposite openings 20 is provided.
    In a second step, a printed circuit board 3 for receiving electronic components in the housing 2 is arranged. In this case, the electronic components are preferably already arranged on the printed circuit board 3. In this case, the printed circuit board 3 is arranged in the housing 2 such that the printed circuit board 3 extends at least partially between the openings 20 of the housing 2.
    Furthermore, (two) bulkheads 5 are arranged in the housing 2 in such a way that these bulkheads 5, together with the housing 2, bound a defined subarea 4 substantially peripherally closed by spatially delimiting the subarea 4 in each case towards the openings 20 , At least one of the bulkheads 5 is formed as a sub-circuit board 50.
    The bulkheads 5, at least the sub-circuit board (s) 50 are mechanically connected to the circuit board 3 and preferably soldered to it. This in particular before the printed circuit board 3 with the connected bulkheads 5 or sub-printed circuit board (s) 50 is arranged in the housing 2. In other words, according to this preferred embodiment, the steps for arranging the circuit board 3 on the one hand and bulkheads 5 on the other hand are performed in a common step. In this way, an automatic placement of the bulkheads 5 is achieved by inserting the circuit board connected to these 3, which reduces the assembly cost.
    When inserting the bulkhead walls 5 and at least the sub-circuit board (s) 50, these are partially inserted laterally into a groove 21 of the housing 2 or guided in this. This leads to a defined positioning of the bulkheads 5 on the one hand and an improved sealing function for the potting process on the other hand. In addition, the corresponding bulkhead 5 can be securely supported during the casting process in the groove 21, as can be clearly seen in FIG.
    To simplify the arrangement of the circuit boards 3, 50 in the housing 2 or optionally also to simplify the Vergießvorganges the housing 2 may be formed in two parts, so that a mounting side for arranging or inserting the circuit board 3 and / or bulkheads 5 or Sub-circuit board 50 in which the housing 2 is selectively exposed. Before or after the Vergießvorgang the housing 2 can then be closed.
    This casting process forms the final step of the process according to the invention. In this case, the portion 4 is potted with a potting compound, which at least just this portion 4 between the openings 20 of the housing 2 fills. Optionally, an additional curing phase or curing step may be provided with at least one, two, or even several treatment steps subsequent to or alternately with multiple potting operations.
    The invention is not limited to the preceding embodiments. Thus, the electronic component 1 can be any conceivable embodiment of corresponding components. Also, the geometric shape of this electronic component 1, the housing 2, the printed circuit board 3, the bulkheads 5 and the sub-printed circuit board (s) 50 is not limited by the invention, as long as they safely surround the portion 4 for a corresponding Vergießvorgang. The opposite ends or openings 20 need not be provided on a straight longitudinal axis of the housing 2. Also, the nature of the circuit boards 3, 50 and the electronic components provided thereon are not limited by the invention. Likewise, the material of the potting compound is not limited by the invention.
    权利要求:
    Claims (10)
    [1]
    claims
    1. Electronic component (1), in particular driver for a luminaire, comprising: a housing (2) with two opposite openings (20), a printed circuit board (3) for receiving electronic components, which in the housing (2) is arranged and extending at least partially between the openings (20) of the housing (2), and a potting compound which fills a defined portion (4) between the openings (20) of the housing (2), wherein the portion (4) to the openings (20 ) is limited spatially by a respective bulkhead (5), which together with the housing (2) delimiting the partial area (4) substantially circumferentially closed, and wherein at least one of the bulkheads (5) as a sub-circuit board (50) is formed ,
    [2]
    2. The electronic component (1) according to claim 1, wherein the sub-circuit board (50) is mechanically and / or electrically connected to the circuit board (3).
    [3]
    3. The electronic component (1) according to claim 1 or 2, wherein the bulkheads (5), at least the sub-printed circuit board (s) (50), are soldered to the circuit board (3).
    [4]
    4. Electronic component (1) according to one of the preceding claims, wherein the bulkheads (5), at least the sub-printed circuit board (s) (50), preferably perpendicular to the printed circuit board (3) and / or substantially parallel to the plane of extension the associated opening (20) extend.
    [5]
    5. The electronic component (1) according to any one of the preceding claims, wherein the bulkheads (5), at least the sub-circuit board (s) (50), at least partially laterally in a groove (21) of the housing (2) are accommodated.
    [6]
    6. Electronic component (1) according to one of the preceding claims, wherein the printed circuit board (3) and / or the sub-printed circuit board (s) (50) have electronic components.
    [7]
    7. Electronic component (1) according to one of the preceding claims, wherein the sub-circuit board (s) (50) has an RFID element, preferably with microchip and antenna, wherein at least a part of the RFID element, in particular the antenna, on the the potting compound or the partial area (4) facing away and preferably facing outward side of the sub-circuit board (50) is provided.
    [8]
    8. The electronic component (1) according to any one of the preceding claims, wherein the sub-circuit board (s) (50) have filter components of an overvoltage protection unit.
    [9]
    9. Luminaire comprising an electronic component (1) according to one of the preceding claims and a light source, in particular an LED, which (s) for the operation of the lamp with the electronic component (1) is electrically connected.
    [10]
    10. A method for producing an electronic component (1), comprising the following steps: - providing a housing (2) with two opposite openings (20), - arranging a printed circuit board (3) for receiving electronic components in the housing (2), so that the circuit board (3) extends at least partially between the openings (20) of the housing (2), - arranging bulkheads (5) in the housing (2) such that these together with the housing (2) has a defined portion (4) limit substantially peripherally closed by spatially delimiting the partial area (4) in each case to the openings (20), wherein at least one of the bulkheads (5) as a sub-circuit board (50) is formed, and - casting the portion (4) with a potting compound, which fills at least the portion (4) between the openings (20) of the housing (2). For this 3 sheets of drawings
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    DE102014200746A1|2015-07-16|Control device and method of assembly
    同族专利:
    公开号 | 公开日
    DE202016101136U1|2017-06-09|
    EP3214909A1|2017-09-06|
    EP3214909B1|2021-12-29|
    引用文献:
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    法律状态:
    2020-01-15| MM01| Lapse because of not paying annual fees|Effective date: 20190531 |
    优先权:
    申请号 | 申请日 | 专利标题
    DE202016101136.1U|DE202016101136U1|2016-03-03|2016-03-03|Electronic component|
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